In the past, standard air-based cooling systems have been the traditional method for keeping Information and Communication Technology (ICT) equipment cool. Air-cooled systems \u2013 often configured with hot\/cold aisles for extra efficiency \u2013 remain<\/a> a straightforward, cost-effective choice for data centers that use conventional air cooling. But this air-cooling approach is not an optimal choice for many newer applications in the hyperscale and data center facilities of the future. Generative AI and GPU-accelerated servers in HPC applications generate<\/a> far more heat than traditional computational loads, and air cooling cannot keep up.<\/p>\n\n\n\n As a result, more data centers are turning to liquid-based cooling methods such as direct-to-chip liquid cooling and immersion cooling. These advanced techniques offer significant energy savings, greater processing capacity, and enhanced sustainability.<\/p>\n\n\n\n Regardless of the thermal approach, data center engineers need reliable power delivery. Air-cooled systems demand power supply unit (PSU) and power distribution unit (PDU) connectors that can withstand elevated ambient temperatures in hot-aisle environments, while immersion cooling requires components that can operate safely when submerged in dielectric fluids.<\/p>\n\n\n\n Air cooling remains<\/a> a common thermal management method for small to midsize data centers with rack densities under around 25 kW. This method uses conventional<\/a> air conditioning technology and airflow management strategies to regulate ICT equipment temperatures and prevent overheating. A method for improving<\/a> the energy efficiency of air-cooled data centers involves implementing hot aisle \/cold aisle configurations with aisle containment systems.<\/p>\n\n\n\n Introduced<\/a> by IBM in 1992, the hot\/cold aisle configuration is one of the oldest ways to conserve energy within a data center. Server racks in this setup are arranged in alternating rows. Cold aisles are the server rows<\/a> facing the rack fronts, while hot aisles align with the back of the servers. Cold air from the computer room air conditioner (CRAC) system is delivered<\/a> via raised floors into the cold aisles, where it is drawn through the front of the servers to cool them. The hot exhaust is then expelled<\/a> into the hot aisles before returning to the CRAC unit along the ceiling vents to complete the cycle.<\/p>\n\n\n\n To improve the efficiency of this setup, many facilities implement the best practices<\/a> outlined in the ANSI\/TIA-942 standard. The recommendations include:<\/p>\n\n\n\n Other methods<\/a> to improve efficiency involve raising air inlet temperatures toward the mid-range of ASHRAE\u2019s 18\u00b0 to 27\u00b0C (64 to 81\u00b0F) guidelines and implementing air-side economizers that leverage outside air for cooling.<\/p>\n\n\n\n Air-cooled systems with hot\/cold aisles remain a common solution for many smaller data centers, offering a familiar and relatively low-cost option for thermal management. The advantages include:<\/p>\n\n\n\n However, there are significant downsides to the air-cooling approach, including:<\/p>\n\n\n\n For data centers with lower rack densities, air cooling systems remain a viable and cost-effective solution for thermal management. However, when rack densities rise, the limitations<\/a> of air cooling become harder to justify unless coupled with liquid cooling. The added thermal load requires significant CRAC capacity expansion, driving up utility costs. <\/p>\n\n\n\n For air-cooled environments with hot\/cold aisles, design engineers must consider connector performance in high-temperature conditions. Hot-aisle environments can reach up to 40-50\u00b0C, and the heat of the flowing electrical current and contact resistance can bring connector temperatures above 70\u00b0C. However, standard IEC C13\/C14-sized appliance couplers usually offer a maximum rating of 70\u00b0C.<\/p>\n\n\n\n Saf-D-Grid\u00ae<\/sup><\/b><\/a> from Anderson Power\u2122<\/sup> is an interconnect solution engineered for hot-aisle environments. With a thermal rating of up to 105\u00b0C depending on the housing selected, Saf-D-Grid provides greater headroom for conducting current in high ambient temperature environments and ensures dependable power delivery under load.<\/p>\n<\/div>\n\n\n\n The original Saf-D-Grid connector that features a thermal temperature up to 105\u00b0C.<\/i><\/p>\n<\/div>\n<\/div>\n\n\n\n As data center workloads intensify, more hyperscale and data center facilities are turning toward immersion cooling as a high-efficiency alternative or addition to traditional air cooling. Reflecting this trend, the immersion cooling market is forecast<\/a> to grow from $1B in 2025 to $3.18B in 2030 at an impressive compound annual growth rate of 26.15%.<\/p>\n\n\n\n While immersion cooling might be a novel method in the data center space, the underlying technology is far from new. Various forms of liquid cooling have existed<\/a> since the late 1800s, when water was used to cool high-voltage transformers. A form of liquid cooling exists<\/a> in many high-performance desktop PCs as a standard way to prevent overheating. Today, the data centers industry is undergoing a similar transformation.<\/p>\n\n\n\n At its core, liquid cooling involves submerging<\/a> ICT equipment into a specialized fluid that absorbs and removes the heat via convection. The heat is transferred<\/a> from the equipment to the fluid, which is then moved away from the equipment and extracted through various methods like heat exchangers or direct liquid-to-liquid cooling. Then, the cooled fluid returns<\/a> to the immersion enclosure, completing the cycle.<\/p>\n\n\n\n Although deionized water is<\/a> a potential coolant, it poses leakage risks and often requires<\/a> a Leak Prevention System (LPS). Instead, modern data centers most often use chemically engineered dielectric fluids. These fluids are<\/a> inert, non-conductive liquids with excellent thermal conductivity and stability, allowing them to absorb heat more efficiently than air and operate safely around electric equipment. They must be<\/a> low in viscosity, non-toxic, non-corrosive, and have a high flash point.<\/p>\n\n\n\n When selecting a dielectric fluid, engineers should consider<\/a> factors such as the fluid\u2019s heat transfer performance, ease of ICT equipment maintenance, material compatibility, environmental impact, and total cost over time. The two main types of dielectric fluids are:<\/p>\n\n\n\n There are several types of liquid cooling approaches, each tailored to different data center requirements. The two general categories include:<\/p>\n\n\n\n Another liquid cooling method is direct-to-chip cooling, where coolant is delivered directly to hotter components, such as GPUs, via cold plates. Rather than immersing the entire server in the dielectric fluid, this method places the cold plate directly on high-heat areas for efficient thermal management. Direct-to-chip systems may be designed as either single phase or two phase systems.<\/p>\n\n\n\n Immersion cooling has typically<\/a> been used in specialized environments, such as HPC and generative AI data centers. However, it is gaining traction in mainstream data centers as operators look for ways to boost sustainability, reduce operational costs, and meet rising performance demands. The benefits of immersion cooling include:<\/p>\n\n\n\n One drawback of immersion cooling systems involves<\/a> their higher upfront costs. Compared to traditional air-cooled systems, immersion setups require expensive specialized equipment like tanks and dielectric fluids. However, immersion cooling\u2019s higher energy efficiency translates<\/a> to lower cooling costs, higher processing power, and reduced energy consumption over time \u2013 offsetting the initial investment in the long run.<\/p>\n\n\n\n The evolution of immersion and liquid cooling is introducing new demands for connector materials and durability. In addition to withstanding electrical and thermal stress, connectors in immersion applications must also be chemically compatible with the dielectric fluids used. Saf-D-Grid <\/b>from Anderson Power is built with tough materials that can withstand exposure to certain dielectric fluids. The connector housing resists degradation with many dielectric fluids, ensuring long-term integrity and reliability even when fully or partially immersed. As liquid cooling technologies continue to advance and potential liquid cooling standards emerge from Open Compute Project<\/a> industry efforts, connector designs like Saf-D-Grid will continue to evolve to support the data centers of the future.<\/p>\n\n\n\n Beyond its durability with immersion cooling applications, Saf-D-Grid delivers additional power density gains to provide a compact, high-performance solution to meet today\u2019s data center challenges. For engineers aiming to optimize power density and save valuable rack space, Saf-D-Grid provides a small but impactful way to meet next-generation power demands. The connector is available in three main configurations, providing engineers with the flexibility to select the sizing, amperage capacity, and voltage support that best align with their specific application:<\/p>\n\n\n\n A Saf-D-Grid connector and power cord customized with a low clearance mating face.<\/i><\/p>\n<\/div>\n<\/div>\n\n\n\n Additional customizable Saf-D-Grid options are available for data centers with unique form factors or performance parameters, such as low-clearance configurations and an extra PDU key. Design engineers can contact Anderson Power<\/a> to learn more about Saf-D-Grid solutions.<\/p>\n\n\n\n Whether they are in liquid-cooled or air-cooled data centers, PDU\/PSU connectors play an important role in maintaining reliable and efficient power delivery. Design engineers with liquid-cooled data centers should select durable connectors that will withstand dielectric fluid exposure. Those with hot aisle environments would be best served by connectors with higher temperature ratings to provide extra headroom to ensure consistent performance.<\/p>\n\n\n\n With industry-leading thermal ratings and a durable housing that withstands many dielectric fluids, Saf-D-Grid is built to meet the demands of different cooling systems. Engineers can rely on this interconnect solution to deliver safe, efficient, and future-proof power connections.<\/p>\n<\/div>\n\n\n\n The Saf-D-Grid Max, a high-amperage interconnect solution.<\/i><\/b><\/p>\n<\/div>\n<\/div>\n\n\nAir Cooling: The Familiar Choice for Lower-Density Data Center Racks<\/h2>\n\n\n\n
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What Are the Advantages and Downsides of Air-Cooled Data Center Technology?<\/h2>\n\n\n\n
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Optimal PDU\/PSU Connectors for Air-Cooled Data Centers<\/h2>\n\n\n\n
\nPower distribution unit (PDU) and power supply unit (PSU) connectors are important components within ICT design. Design engineers working within air-cooled hot\/cold aisle data centers should weigh unique considerations when selecting their PDU and PSU connectors. These connectors and power cords are critical for connecting the PDU to the switch, the PDU to the server, the PDU to storage, and more.<\/p>\n\n\n\n![\"Close-up](\"https:\/\/p1.aprimocdn.net\/idealindustries\/fcc0db76-0a25-4785-98a2-b3f00073eeb8\/ap-web_product-images_2025-ap-sdg-web-01_Original%20file.png\")
<\/figure>\n\n\n\nWhat Is Liquid\/Immersion Cooling in Data Centers?<\/h2>\n\n\n\n
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What Are the Types of Liquid Cooling?<\/h2>\n\n\n
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What Are the Advantages and Disadvantages of Liquid Cooling?<\/h2>\n\n\n\n
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What PDU\/PSU Connectors Are Optimal for Liquid-Cooled Data Centers?<\/h2>\n\n\n\n
What Are the Types of Saf-D-Grid and Their Power Capacity?<\/h2>\n\n\n\n
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<\/figure>\n\n\n\nAir and Liquid Cooling and the Future of Data Centers<\/h2>\n\n\n\n
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<\/figure>\n\n\t<\/div>\n<\/div>\nThe Data Center Connector You CAN Trust<\/h3>\n\n\t<\/div>\n<\/div>\n